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Within Teledyne FLIR’s extensive portfolio, the Boson family offers users the most dynamic and highest-performing range of uncooled thermal imaging technology currently available. The small, lightweight and low-power devices offer multiple configurations and onboard image processing for both qualitative and quantitative thermal imaging applications.

Manufactured entirely in the United States, the Boson family of long-wave infrared (LWIR) thermal camera module sets for original equipment manufacturers sets the standard for size, weight and power consumption (SWaP) performance. Leveraging the company’s advanced image processing technology, coupled to a number of industry-standard communication interfaces, the range of Boson devices powerfully enables applications across a host of highly demanding domains – from firefighting to unmanned aircraft systems (UAS), and from security systems to automotive development kits – all at as little as 600mW. The 12µm uncooled detector is available in two resolutions – 640×512 and 320×256 – with multiple frame rate options. There are radiometric options, offering absolute temperature measurement, and with multiple lens configurations, an easy-to-use Boson SDK, a user-friendly graphical user interface (GUI), and comprehensive product integration documentation, OEM integration into higher-level systems is greatly facilitated and simplified.

In early April, Teledyne FLIR unveiled a significantly enhanced capability – the Boson+ – that incorporates thermal sensitivity of 20 millikelvin (mK) or less. This makes it the most thermally sensitive LWIR device currently available on the market, replicating and leveraging the industry-leading SWaP characteristics of the widely-available Boson thermal camera module – well-proven in the global market. Boasting identical mechanical, electrical, and optical interfaces, the Boson+ is a drop-in upgrade that also includes updated image processing, to deliver enhanced sharpness and contrast for both defence and commercial applications. The unrivalled combination of LWIR thermal performance and SWaP leadership offers reduced risk development opportunities for a wide variety of applications that make stringent demands on technology.

Improved thermal sensitivity and automatic gain control (AGC) allows for more scene detail in the image, for better detection, specifically in outdoor low-contrast scenes,” said Dan Walker, Vice President, Product Management, OEM Cores at Teledyne FLIR. “Improved thermal performance and proven market-leading reliability make it the ideal uncooled thermal module for integration in unmanned platforms, security applications, handhelds, wearables, and thermal sights”.

Manufactured in the United States, the Boson+ includes a redesigned 640×512 resolution, 12-micron pixel pitch detector with a noise equivalent differential temperature (NEDT) of 20mK or less: this offers significantly enhanced detection, recognition, and identification (DRI) performance and is combined with improved video latency, which in turn enhances tracking, seeker performance, and decision support, leading to an overall operational performance enhancement that is noticeable.

The shared Boson series interface, and access to the US-based Teledyne FLIR Technical Services team, offer reduced development risk and accelerated time to market opportunities. Truly designed for integrators, the Boson+ is available with a host of options, comprehensive product documentation and, above all, is dual use and classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a.

Teledyne FLIR, a Teledyne Technologies company, is a world leader in intelligent sensing solutions for a range of demanding operator communities that include armed forces, security authorities and emergency management agencies, among others. Founded in 1978, the company now has some 4,000 employees worldwide, creating technologies to help professionals make better, faster decisions that save lives and livelihoods.


The Boson+ possesses impressive SWaP credentials, making it an ideal candidate for integration into space-constrained environments, such as surveillance and UAS applications. (Teledyne FLIR)

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