Hensoldt and Nano Dimension to Collaborate

3D Structural Electronics Driven by Need for Miniaturisation and Modularity

Hensoldt is to enter into strategic collaboration with Israeli additive electronics provider Nano Dimension, the companies announed on 12 June.

Hensoldt engineers will work closely with Nano Dimension’s engineering team to develop innovative applications for the former’s security and defence business. Hensoldt was one of the first European companies to use Nano Dimension’s DragonFly Pro printer to manufacture printed electronics and has already printed hundreds of complex circuit boards. The company will now expand its use of the additive manufacturing solution, with the aim of accelerating accessibility and adoption of electronics manufacturing, paving the way for the manufacture of products and components with integrated functionality – better known as 3D structural electronics. The push for new products and components is largely being driven by the need for miniaturisation and modularity in design.

The collaboration leverages Nano Dimension’s market leadership in additive manufacturing of printed electronics and Hensoldt’s advanced defence and security technologies. “Our focus is on providing our customers with the highest quality cutting-edge innovations,” commented Hensoldt Head of Engineering, Thomas Stocker. “By using the DragonFly, we’ve already accelerated our application development. Now, our strategic collaboration with Nano Dimension is further empowering our engineers in expediting product development cycles, while giving them the freedom to explore next-generation designs and solutions not possible with traditional manufacturing methods.”

HENSOLDT is doing some of the most advanced electronics work in the world, and we are delighted that our engineering team can help them lead the change in developing additive manufacturing in electronics and building the applications of tomorrow,” added Nano Dimension’s CEO, Amit Dror. “We expect to see great advances in electronics technology emerge through this collaboration.”

Publish date

06/13/2019

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